• DocumentCode
    2366710
  • Title

    Preparation of nanometer silicon carbide powders by sol-gel processing

  • Author

    Wu, Zhao ; Zhang, Zhiyong ; Yan, Junfeng ; Zhai, Chunxue ; Yun, Jiangni

  • Author_Institution
    Sch. of Inf. Sci. & Technol., Northwest Univ., Xian
  • fYear
    2008
  • fDate
    24-27 March 2008
  • Firstpage
    394
  • Lastpage
    396
  • Abstract
    Nanometer silicon carbide powders are synthesized by sol-gel and carbothermal reduction processing with TEOS(tetraethoxysilane, (C2H5)4SiO4) and saccharose (C12H22O11) as starting materials. Silica sol is prepared by hydrolyzed TEOS with deionized water, ethanol (CH3CH2OH) as cosolvent and hydrochloric acid as catalyst. It further dehydrated to make colorless and transparent gel and dried to obtain drying gel at 40degC. Carbothermal reduction of the prepared silica/saccharose composites is carried out in argon atmosphere of 500 Pa in a high vacuum furnace at temperatures ranging from 1200 degC to 1500 degC to form powders. The surface morphology and crystal structure of nanometer SiC powders have been investigated using X-ray diffraction (XRD), atomic force microscopy (AFM) and Raman spectrum. Experimental results show that the samples have better crystalline state and its typical diameters reach nanometer magnitude.
  • Keywords
    Raman spectra; X-ray diffraction; atomic force microscopy; nanoparticles; sol-gel processing; Raman spectrum; X-ray diffraction; atomic force microscopy; carbothermal reduction processing; hydrochloric acid; nanometer silicon carbide powders; sol-gel processing; Argon; Atmosphere; Atomic force microscopy; Crystallization; Ethanol; Furnaces; Powders; Silicon carbide; Silicon compounds; Temperature distribution; Carbothennal reduction; Silicon carbide powders; Sol-gel;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanoelectronics Conference, 2008. INEC 2008. 2nd IEEE International
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-1572-4
  • Electronic_ISBN
    978-1-4244-1573-1
  • Type

    conf

  • DOI
    10.1109/INEC.2008.4585513
  • Filename
    4585513