DocumentCode
2366791
Title
Thermal Spreading Resistance for Square and Rectangular Entities
Author
Bhatt, Alok ; Rhee, Jinny
Author_Institution
State Univ., San Jose, CA
fYear
0
fDate
0-0 0
Firstpage
175
Lastpage
178
Abstract
A systematic study was performed using numerical modeling to understand the effects of thermal spreading resistance on the total resistance from junction to ambient for square and rectangular entities. Simultaneously, a literature survey was conducted to understand effects of thermal spreading resistance on circular, square and rectangular heat sources and heat spreading plates. Simulation from numerical model (Flotherm) was then compared with results from analytical solution derived by Lee and Ellison for square and rectangular heat sources respectively as a benchmarking process for the numerical model. The model presumes a heat source on a large cooling plate beneath which has a constant heat transfer coefficient on the sink side. Numerical simulations were performed for steady-state conditions with different range of dimensions for source to plate edge length ratio and dimensionless thickness. Results for dimensionless spreading resistance as a function of relative contact size, plate thickness and Biot number were derived using Flotherm and compared with the analytical models mentioned above. Results show that numerical modeling using software like Flotherm can offer excellent results within acceptable percentage difference when compared to analytical solutions
Keywords
heat sinks; thermal analysis; thermal management (packaging); thermal resistance; Biot number; Flotherm; constriction resistance; heat sources; heat spreading plates; heat transfer; thermal spreading resistance; Analytical models; Cooling; Heat sinks; Heat transfer; Immune system; Numerical models; Numerical simulation; Resistance heating; Thermal conductivity; Thermal resistance; Thermal spreading resistance; constriction resistance; dimensionless spreading resistance; high power LEDs;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials: Processes, Properties and Interface, 200611th International Symposium on
Conference_Location
Atlanta, GA
ISSN
1550-5723
Print_ISBN
1-4244-0260-3
Type
conf
DOI
10.1109/ISAPM.2006.1666040
Filename
1666040
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