DocumentCode :
2366794
Title :
Reliability of thick Al wire bonds in IGBT modules for traction motor drives
Author :
Onuki, Jin ; Koizumi, Masahiro
Author_Institution :
Res. Lab., Hitachi Ltd., Ibaraki, Japan
fYear :
1995
fDate :
23-25 May 1995
Firstpage :
428
Lastpage :
433
Abstract :
Reliability of thick Al wire bonds during the thermal fatigue test has been investigated from a metallurgical viewpoint. The bond interface between Al wires and Al-Si films was found to be a coincidence boundary or a boundary with very fine grain size, and hence so strong that cracks advanced along the grain boundary of the wire at the bonding interface in the accelerated thermal fatigue test. It was also found that crack growth rate could be reduced considerably by enlarging the grain size at the interface. The hypothesis that bonds would not degrade in actual use of traction motor drives was presented on the basis of the fatigue theory of Al
Keywords :
aluminium; cracks; fatigue; grain boundaries; grain size; insulated gate bipolar transistors; interface phenomena; lead bonding; life testing; modules; semiconductor device packaging; semiconductor device reliability; thermal stress cracking; thermal stresses; traction motor drives; Al-AlSi; Al-Si films; IGBT modules; accelerated test; bond interface; crack growth rate; cracks; grain boundary; grain size; reliability; thermal fatigue test; thick Al wire bonds; traction motor drives; Bonding; Fatigue; Grain boundaries; Grain size; Insulated gate bipolar transistors; Life estimation; Testing; Thermal degradation; Traction motors; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices and ICs, 1995. ISPSD '95., Proceedings of the 7th International Symposium on
Conference_Location :
Yokohama
ISSN :
1063-6854
Print_ISBN :
0-7803-2618-0
Type :
conf
DOI :
10.1109/ISPSD.1995.515076
Filename :
515076
Link To Document :
بازگشت