DocumentCode
2366852
Title
Antistatic masking tapes for solder flux reflow processing of printed circuit boards
Author
Ball, Alan ; Yau, Steve ; Gutman, Gustav ; Swenson, David E.
Author_Institution
Electr. Specialities Div., 3M Co., Austin, TX, USA
fYear
1996
fDate
10-12 Sept. 1996
Firstpage
241
Lastpage
247
Abstract
This work shows that it is possible to develop acrylate adhesive masking tapes for the most demanding current forms of electronic device soldering. Performance testing confirms that these tapes are suitably stable at high temperature. They also retain their unique capability for subduing electrostatic charge generation. In this property these tapes exceeded the performance of all similar tapes, to which they were compared, including silicone-based tapes.
Keywords
electrostatics; printed circuit manufacture; reflow soldering; acrylate adhesive; antistatic masking tape; electronic device; electrostatic charge generation; printed circuit board; solder flux reflow processing; Electrostatic analysis; Printed circuit fabrication; Soldering;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Overstress/Electrostatic Discharge Symposium, 1996. Proceedings
Print_ISBN
1-878303-69-4
Type
conf
DOI
10.1109/EOSESD.1996.865148
Filename
865148
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