DocumentCode
2367451
Title
Three-dimensional simulation of ion implantation
Author
Lorenz, J. ; Tietzel, K. ; Bourenkov, A. ; Ryssel, H.
Author_Institution
Fraunhofer-Inst. fur Integrierte Schaltungen, Erlangen, Germany
fYear
1996
fDate
2-4 Sept. 1996
Firstpage
23
Lastpage
24
Abstract
With shrinking dimensions and growing complexity of advanced ULSI devices three-dimensional effects are becoming more and more important for their development and optimization. For this reason, within the project PROMPT a multidimensional process simulation software capable to provide appropriate input to three-dimensional device simulation has been developed by a European consortium. The PROMPT software compiles the geometry and the dopant profiles of the device from the results of existing one- and two-dimensional process simulators and three-dimensional modules newly developed. Within this presentation, the capabilities of the three-dimensional ion implantation module developed at FhG-IIS-B within PROMPT are being outlined.
Keywords
ion implantation; semiconductor process modelling; FhG-IIS-B; PROMPT software; ULSI device; dopant profile; ion implantation; multidimensional process simulation; three-dimensional device simulation; Convolution; Crystallization; Ion beams; Ion implantation; Multidimensional systems; Nonhomogeneous media; Semiconductor process modeling; Solid modeling; Surface topography; Surface treatment;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation of Semiconductor Processes and Devices, 1996. SISPAD 96. 1996 International Conference on
Print_ISBN
0-7803-2745-4
Type
conf
DOI
10.1109/SISPAD.1996.865255
Filename
865255
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