• DocumentCode
    2367451
  • Title

    Three-dimensional simulation of ion implantation

  • Author

    Lorenz, J. ; Tietzel, K. ; Bourenkov, A. ; Ryssel, H.

  • Author_Institution
    Fraunhofer-Inst. fur Integrierte Schaltungen, Erlangen, Germany
  • fYear
    1996
  • fDate
    2-4 Sept. 1996
  • Firstpage
    23
  • Lastpage
    24
  • Abstract
    With shrinking dimensions and growing complexity of advanced ULSI devices three-dimensional effects are becoming more and more important for their development and optimization. For this reason, within the project PROMPT a multidimensional process simulation software capable to provide appropriate input to three-dimensional device simulation has been developed by a European consortium. The PROMPT software compiles the geometry and the dopant profiles of the device from the results of existing one- and two-dimensional process simulators and three-dimensional modules newly developed. Within this presentation, the capabilities of the three-dimensional ion implantation module developed at FhG-IIS-B within PROMPT are being outlined.
  • Keywords
    ion implantation; semiconductor process modelling; FhG-IIS-B; PROMPT software; ULSI device; dopant profile; ion implantation; multidimensional process simulation; three-dimensional device simulation; Convolution; Crystallization; Ion beams; Ion implantation; Multidimensional systems; Nonhomogeneous media; Semiconductor process modeling; Solid modeling; Surface topography; Surface treatment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation of Semiconductor Processes and Devices, 1996. SISPAD 96. 1996 International Conference on
  • Print_ISBN
    0-7803-2745-4
  • Type

    conf

  • DOI
    10.1109/SISPAD.1996.865255
  • Filename
    865255