DocumentCode
2367511
Title
Nano-tailoring of carbon nanotube as nano-fillers for composite materials applications
Author
Baudot, Charles ; Tan, Cher Ming ; Wang, Charles
Author_Institution
ST Microelectron. Asia Pacific Pte Ltd., Singapore
fYear
2008
fDate
24-27 March 2008
Firstpage
570
Lastpage
572
Abstract
In this paper molecular level tailoring of carbon nanotube has been developed in order to get a high degree of precision for specific applications. The selection of molecules to be grafted to carbon nanotube surface was given an emphasis because it has the role for composite matrix and the filler interfaces. This molecules are covalently bonded with the sidewalls and/or tips of the nanotubes during polymerisation process. Fourier transform infrared spectroscopy was used for nanotube analysis. Results revealed that even though it is difficult to give a clear definition to uniform dispersion of nanoparticles on a macroscopic scale, this method can still be affirmed to improve considerably the dispersion of the nanotubes in a polymer matrix. Further work must still be done to improve the yield of reaction, to ensure that the number of functionalized sites per unit length of nanotube is almost the same and to determine the effect of the bonded molecules on the intrinsic physical properties of the carbon nanotubes.
Keywords
Fourier transform spectra; bonds (chemical); carbon nanotubes; disperse systems; filled polymers; infrared spectra; molecules; nanocomposites; nanoparticles; polymerisation; C; Fourier transform infrared spectroscopy; carbon nanotube; carbon nanotube surface; composite material applications; composite matrix; covalent bonds; dispersion; grafting; macroscopic scale; molecules; nanofillers; nanoparticles; nanotailoring; polymer matrix; polymerisation; Carbon nanotubes; Composite materials; Nanocomposites; Nanoelectronics; Nanostructured materials;
fLanguage
English
Publisher
ieee
Conference_Titel
Nanoelectronics Conference, 2008. INEC 2008. 2nd IEEE International
Conference_Location
Shanghai
Print_ISBN
978-1-4244-1572-4
Electronic_ISBN
978-1-4244-1573-1
Type
conf
DOI
10.1109/INEC.2008.4585552
Filename
4585552
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