DocumentCode :
2367522
Title :
Ballistic quantum transport in nano devices and circuits
Author :
Arora, Vijay K.
Author_Institution :
Fac. of Electr. Eng., Univ. Teknol. Malaysia, Skudai
fYear :
2008
fDate :
24-27 March 2008
Firstpage :
573
Lastpage :
578
Abstract :
Ohmpsilas law, a linear current-voltage pattern, has been and continues to be the basis for characterizing, evaluating performance, and designing integrated circuits, but is shown not to hold its supremacy as channel lengths are being scaled down. In a nanoscale circuit with reduced dimensionality in one or more of the three Cartesian directions, quantum effects transform the carrier statistics. In the high electric field, the collision free ballistic transform is predicted, while in low electric field the transport remains predominantly scattering-limited. In a micro/nano-circuit, even a low logic voltage of 1 V is above the critical voltage Vc (VGtVc) triggering nonohmic behavior that results in ballistic current saturation. The saturation current is now controlled by ballistic (B) saturation velocity that is comparable to an appropriate thermal velocity for a nondegenerate and Fermi velocity for a degenerate system with given dimensionality. A quantum emission may lower this ballistic velocity. A review of the physics behind breakdown of Ohmpsilas law and existence of quantum effects in engineering low-dimensional nanoelectronic devices is given.
Keywords :
ballistic transport; electric field effects; integrated circuit modelling; nanoelectronics; semiconductor device models; Fermi velocity; ballistic current saturation; ballistic quantum transport; ballistic saturation velocity; nanoelectronic devices; nanoscale circuits; quantum effect; quantum emission; thermal velocity; Circuits; Control systems; Electric breakdown; Logic; Low voltage; Nanoscale devices; Particle scattering; Physics; Statistics; Velocity control;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nanoelectronics Conference, 2008. INEC 2008. 2nd IEEE International
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1572-4
Electronic_ISBN :
978-1-4244-1573-1
Type :
conf
DOI :
10.1109/INEC.2008.4585553
Filename :
4585553
Link To Document :
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