DocumentCode
2367633
Title
Effect of channel length on NBTI in sub-100nm CMOS technology
Author
Jin, Lei ; Xu, Mingzhen
Author_Institution
Inst. of Microelectron., Peking Univ., Beijing
fYear
2008
fDate
24-27 March 2008
Firstpage
597
Lastpage
600
Abstract
The channel length dependence of NBTI degradation in a sub-100 nm CMOS technology is studied. It is shown that the enhanced interface trap generation near the gate edge is primarily responsible for the channel length dependence of NBTI degradation. The possible contribution of oxide charges, although may not be ruled out, plays a less important role.
Keywords
CMOS integrated circuits; integrated circuit reliability; interface states; CMOS technology; channel length; enhanced interface trap generation; negative bias temperature instability; oxide charges; CMOS technology; Nanoelectronics; Niobium compounds; Titanium compounds;
fLanguage
English
Publisher
ieee
Conference_Titel
Nanoelectronics Conference, 2008. INEC 2008. 2nd IEEE International
Conference_Location
Shanghai
Print_ISBN
978-1-4244-1572-4
Electronic_ISBN
978-1-4244-1573-1
Type
conf
DOI
10.1109/INEC.2008.4585558
Filename
4585558
Link To Document