• DocumentCode
    236778
  • Title

    Operational field coupled ESD susceptibility of magnetic sensor IC´s in automotive applications

  • Author

    Rostamzadeh, Cyrous ; Williams, Kresimir ; Kado, R.

  • Author_Institution
    Robert Bosch LLC, Plymouth, MI, USA
  • fYear
    2014
  • fDate
    4-8 Aug. 2014
  • Firstpage
    144
  • Lastpage
    149
  • Abstract
    Modern automobiles feature more than 80 applications that rely on magnetic sensors. Magnetic or hall-effect sensor ICs are extremely temperature-stable and stress resistant devices especially suited for operating over extended temperature ranges to 150°C ideal for harsh automotive environment. More than 2 billion hall-effect sensors are manufactured annually for automotive applications. Hall-effect sensors are integral part of safety, power train, and body electronics. The potential for magnetic sensor IC damage when exposed to Operating Field Coupled Electrostatic Discharge is of key interest. Continuous trends in IC industry (shrinking geometries), and wire-bond transitioning from gold to copper (15 μm) may decrease the reliability and increase the failure rate.
  • Keywords
    Hall effect transducers; automotive electronics; electrostatic discharge; integrated circuits; magnetic sensors; temperature sensors; Hall-effect sensor ICs; IC industry; automotive applications; body electronics; harsh automotive environment; magnetic sensor IC damage; operating field coupled electrostatic discharge; operational field coupled ESD susceptibility; power train; reliability; safety; size 15 mum; stress resistant devices; temperature-stable resistant devices; wire-bond; Automotive engineering; Couplings; DC motors; Discharges (electric); Electrostatic discharges; Impedance; Integrated circuits; Field Coupled Electrostatic Discharge; Hall-Effect Sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (EMC), 2014 IEEE International Symposium on
  • Conference_Location
    Raleigh, NC
  • Print_ISBN
    978-1-4799-5544-2
  • Type

    conf

  • DOI
    10.1109/ISEMC.2014.6898959
  • Filename
    6898959