DocumentCode
2367803
Title
Thermal simulation of PCBs with embedded resistors
Author
Witwit, A.M.R. ; Stubbs, D. ; Pulko, S.H. ; Wilkinson, A.J.
Author_Institution
Dept. of Electron. Eng., Hull Univ., UK
fYear
1998
fDate
30 Sep-2 Oct 1998
Firstpage
313
Lastpage
316
Abstract
The application of the transmission line matrix (TLM) method to PCB structures incorporating heat generating integrated resistors is described. We investigate the sensitivity of resistor temperature with respect to resistor area, and the number and size of via holes. The temperature of resistors embedded in different layers of a 6-layer PCB structure is investigated. It is found that resistors on the surface layer suffer a greater temperature increase than those which are embedded. It is shown that the presence of copper on a layer drastically reduced the temperature on that layer
Keywords
printed circuit design; 6-layer PCB structure; PCB simulation; TLM method; copper; embedded resistors; heat generating integrated resistors; resistor area; resistor temperature; surface layer; thermal simulation; transmission line matrix method; via holes;
fLanguage
English
Publisher
iet
Conference_Titel
Simulation '98. International Conference on (Conf. Publ. No. 457)
Conference_Location
York
ISSN
0537-9989
Print_ISBN
0-85296-709-8
Type
conf
DOI
10.1049/cp:19980656
Filename
731868
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