DocumentCode
2367999
Title
Between-core vector overlapping for test cost reduction in core testing
Author
Shinogi, Tsuyoshi ; Yamada, Yuki ; Hayashi, Terumine ; Yoshikawa, Tomohiro ; Tsuruoka, Shinji
Author_Institution
Dept. of Electr. & Electron. Eng., Mie Univ., Tsu, Japan
fYear
2003
fDate
16-19 Nov. 2003
Firstpage
268
Lastpage
273
Abstract
This paper proposes a novel method, called "between-core vector overlapping", for parallel core testing of an SoC consisting of full-scanned cores. This method uses small number of input pins in the parallel core testing. An "over-lapped vector" obtained by overlapping all the vectors for all the core is supplied to all the cores in common for parallel core testing. Two methods for short overlapped vectors, "invert overlapping" and "split overlapping", are presented. The impact of further reduction in the number of input pins is also reported.
Keywords
automatic test pattern generation; design for testability; integrated circuit testing; large scale integration; system-on-chip; ATPG; LSI testing; between-core vector overlapping; core testing; design for testing; full-scanned cores; greedy-based algorithm; invert overlapping; number of input pins; parallel core testing; short overlapped vectors; split overlapping; system-on-a-chip; test cost reduction; Circuit testing; Clocks; Costs; Design for testability; Integrated circuit testing; Large-scale integration; Pins; Signal design; Timing;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Symposium, 2003. ATS 2003. 12th Asian
ISSN
1081-7735
Print_ISBN
0-7695-1951-2
Type
conf
DOI
10.1109/ATS.2003.1250821
Filename
1250821
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