Title :
Between-core vector overlapping for test cost reduction in core testing
Author :
Shinogi, Tsuyoshi ; Yamada, Yuki ; Hayashi, Terumine ; Yoshikawa, Tomohiro ; Tsuruoka, Shinji
Author_Institution :
Dept. of Electr. & Electron. Eng., Mie Univ., Tsu, Japan
Abstract :
This paper proposes a novel method, called "between-core vector overlapping", for parallel core testing of an SoC consisting of full-scanned cores. This method uses small number of input pins in the parallel core testing. An "over-lapped vector" obtained by overlapping all the vectors for all the core is supplied to all the cores in common for parallel core testing. Two methods for short overlapped vectors, "invert overlapping" and "split overlapping", are presented. The impact of further reduction in the number of input pins is also reported.
Keywords :
automatic test pattern generation; design for testability; integrated circuit testing; large scale integration; system-on-chip; ATPG; LSI testing; between-core vector overlapping; core testing; design for testing; full-scanned cores; greedy-based algorithm; invert overlapping; number of input pins; parallel core testing; short overlapped vectors; split overlapping; system-on-a-chip; test cost reduction; Circuit testing; Clocks; Costs; Design for testability; Integrated circuit testing; Large-scale integration; Pins; Signal design; Timing;
Conference_Titel :
Test Symposium, 2003. ATS 2003. 12th Asian
Print_ISBN :
0-7695-1951-2
DOI :
10.1109/ATS.2003.1250821