• DocumentCode
    2367999
  • Title

    Between-core vector overlapping for test cost reduction in core testing

  • Author

    Shinogi, Tsuyoshi ; Yamada, Yuki ; Hayashi, Terumine ; Yoshikawa, Tomohiro ; Tsuruoka, Shinji

  • Author_Institution
    Dept. of Electr. & Electron. Eng., Mie Univ., Tsu, Japan
  • fYear
    2003
  • fDate
    16-19 Nov. 2003
  • Firstpage
    268
  • Lastpage
    273
  • Abstract
    This paper proposes a novel method, called "between-core vector overlapping", for parallel core testing of an SoC consisting of full-scanned cores. This method uses small number of input pins in the parallel core testing. An "over-lapped vector" obtained by overlapping all the vectors for all the core is supplied to all the cores in common for parallel core testing. Two methods for short overlapped vectors, "invert overlapping" and "split overlapping", are presented. The impact of further reduction in the number of input pins is also reported.
  • Keywords
    automatic test pattern generation; design for testability; integrated circuit testing; large scale integration; system-on-chip; ATPG; LSI testing; between-core vector overlapping; core testing; design for testing; full-scanned cores; greedy-based algorithm; invert overlapping; number of input pins; parallel core testing; short overlapped vectors; split overlapping; system-on-a-chip; test cost reduction; Circuit testing; Clocks; Costs; Design for testability; Integrated circuit testing; Large-scale integration; Pins; Signal design; Timing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Symposium, 2003. ATS 2003. 12th Asian
  • ISSN
    1081-7735
  • Print_ISBN
    0-7695-1951-2
  • Type

    conf

  • DOI
    10.1109/ATS.2003.1250821
  • Filename
    1250821