DocumentCode :
2368296
Title :
Fault-injection algorithm for the error of the single-event upset and calculation for the error resistance by coated nanofilms
Author :
Pan, Ainghe ; Hong, Bingrong ; Pan, Qishu ; Wang, Di ; Hu, Lijiang
Author_Institution :
Sch. of Comput. Sci. & Technol., Harbin Inst. of Technol., Harbin
fYear :
2008
fDate :
24-27 March 2008
Firstpage :
719
Lastpage :
723
Abstract :
In this work, the R_T_S model based on simultaneous equations (R, T and S) and Catastrophe Theory is performed to describe the behavior of fault injection and the influence of fault injection on a system. The system was selected as a chip in a microelectronic device of a satellite, which is often failed to work by an error of the single-event upset (SEU). A fault-injection algorithm (FI_S) based on the S attribute of the model R_T_S is designed to analyze the errors in the attacked system. Based on silsesquioxane derive from hydrolytic condensation of [(gamma-glycidoxy)propyl]trimethoxysilane (GPMS), [(-methacryloxy)propyl]trimethoxysilane (MPMS) and (vinyl)trimethoxysilane (VMS), three nanofilm (f-GS, f-MS and f-VS) was coated on chips to protect from the fault. The equation expressing the relationship between the energy and the displacement of a charged particle was deduced. The total displacement where the higher energy was reduced by the inhibition of the nanofilm, can be calculated. As the result of the calculation, the f-VS coating has the best resistance to the SEU error because of its denser nanostructure.
Keywords :
catastrophe theory; electrical faults; error analysis; integrated circuit modelling; nanostructured materials; organic-inorganic hybrid materials; thin films; R_T_S model; catastrophe theory; coated nanofilms; error resistance; fault injection algorithm; hydrolytic condensation; microelectronic device; satellite; silsesquioxane; single-event upset; Nanoelectronics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nanoelectronics Conference, 2008. INEC 2008. 2nd IEEE International
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1572-4
Electronic_ISBN :
978-1-4244-1573-1
Type :
conf
DOI :
10.1109/INEC.2008.4585586
Filename :
4585586
Link To Document :
بازگشت