DocumentCode :
236839
Title :
Bench level automotive EMC validation test laboratory challenges and preferences
Author :
Banasky, Lawrence
Author_Institution :
Electromagn. Compatibility, Ford Motor Co., Dearborn, MI, USA
fYear :
2014
fDate :
4-8 Aug. 2014
Firstpage :
307
Lastpage :
315
Abstract :
Automotive original equipment manufacturers (OEMs) and suppliers of electrical and electronic subsystems are required to perform bench level electrical and electromagnetic compatibility (EMC) validation testing. This is an important process that requires a significant investment in time and money. In an effort to improve the efficiency of testing, a survey was developed to gain an understanding of the challenges faced by test laboratories and also their preferences. This paper summarizes the results of the survey. Given the amount of time and money spent annually for the type of testing considered, the results suggest that pursuing improvements will result in a long term savings for the original equipment manufacturers (OEMs), suppliers, and labs involved. In order to increase test efficiency, the OEMs, suppliers, and laboratories will need to work together to better prepare test plans and test setups. It is suggested that the results of this survey are used to prioritize the improvement activities.
Keywords :
automotive electronics; electromagnetic compatibility; OEM; automotive original equipment manufacturers; bench level automotive EMC validation test; electrical subsystems; electromagnetic compatibility; electronic subsystems; original equipment manufacturers; test plans; test setups; testing; Automotive engineering; Electromagnetic compatibility; Laboratories; Software; Standards; Time-frequency analysis; Automotive; Bench Level; Electromagnetic Compatibility (EMC); Laboratories; Subsystem; Test; Validation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility (EMC), 2014 IEEE International Symposium on
Conference_Location :
Raleigh, NC
Print_ISBN :
978-1-4799-5544-2
Type :
conf
DOI :
10.1109/ISEMC.2014.6898989
Filename :
6898989
Link To Document :
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