Title :
Improved heat-dissipating silicone by Nano-materials for LED packaging
Author :
Cao, M.L. ; Pang, F.Y. ; Zhang, M.C. ; Cheng, Z.J. ; Gao, Y. ; He, P.G. ; Pane, L.K. ; Sun, Z.
Author_Institution :
Dept. of Chem., East China Normal Univ., Shanghai
Abstract :
Nano-diamond particles with the size of 5 nm were dispersed into silicone materials to form diamond/silicone nano-composite films. The films were characterized with scanning electron microscopy, UV-visible optical transmittance spectroscopy, and hot disk thermal constant analysis instrument. The results showed that the thermal conductivity of silicone was enhanced twice without much sacrifice of transmittance when silicone was doped with 0.02% nano-diamond particles.
Keywords :
cooling; electronics packaging; light emitting diodes; nanocomposites; thermal conductivity; LED packaging; UV-visible optical transmittance spectroscopy; diamond-silicone nanocomposite films; heat-dissipating silicone; hot disk thermal constant analysis instrument; nanodiamond particles; nanomaterials; scanning electron microscopy; thermal conductivity; Conducting materials; Electron optics; Light emitting diodes; Optical films; Optical materials; Optical microscopy; Packaging; Scanning electron microscopy; Semiconductor films; Thermal conductivity; LED packaging; Nano-diamond; Thermal conductivity;
Conference_Titel :
Nanoelectronics Conference, 2008. INEC 2008. 2nd IEEE International
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1572-4
Electronic_ISBN :
978-1-4244-1573-1
DOI :
10.1109/INEC.2008.4585595
