DocumentCode :
2368619
Title :
Importance of Data Quality in Virtual Metrology
Author :
Huang, Yi-Ting ; Cheng, Fan-tien ; Chen, Yeh-Tung
Author_Institution :
Inst. of Manuf. Eng., Nat. Cheng Kung Univ., Tainan
fYear :
2006
fDate :
6-10 Nov. 2006
Firstpage :
3727
Lastpage :
3732
Abstract :
The purpose of VM is to enable the manufacturers to conjecture the wafer quality and deduce the causes of defects without performing physical metrology. VM requires a large amount of sensor data retrieved from production tools. However, inappropriateness and instability of the data collection system, which leads to incorrectness, fragment and asynchrony of data collected, may lead to inaccurate conjecture results. Hence, not only precision of the VM conjecture module but also quality of the collected data are essential to ensure accurate and stable VM results for improving production yield. In this work, the importance of data quality to VM is investigated. The data quality mechanism is proposed for data characteristic analysis, data anomaly detection, data cleaning, data normalization, and data reduction. Besides, the equipment of semiconductor chemical vapor deposition (CVD) is adopted as a practical example to illustrate the significance of data quality mechanism, and further verify feasibility and effectiveness of VM
Keywords :
chemical vapour deposition; production engineering computing; semiconductor device manufacture; data anomaly detection; data characteristic analysis; data cleaning; data collection system instability; data normalization; data quality mechanism; data reduction; production tools; semiconductor chemical vapor deposition; virtual metrology; wafer quality; Costs; Data engineering; Information retrieval; Job shop scheduling; Manufacturing processes; Metrology; Monitoring; Production equipment; Semiconductor device manufacture; Virtual manufacturing; Virtual metrology; data quality;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
IEEE Industrial Electronics, IECON 2006 - 32nd Annual Conference on
Conference_Location :
Paris
ISSN :
1553-572X
Print_ISBN :
1-4244-0390-1
Type :
conf
DOI :
10.1109/IECON.2006.347318
Filename :
4153229
Link To Document :
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