Title :
Practical de-embedding solution for PoP devices using a transfer function methodology
Author :
Romo, G. ; Powers, Sarah ; Michalka, Tim ; Jasdanwala, Saifee
Author_Institution :
Power & Signal Integrity Group, Qualcomm Technol., Inc., San Diego, CA, USA
Abstract :
This paper presents a de-embedding methodology based on transfer function concepts applicable to probed measurements performed on PoP configurations for a highperformance SoC. This methodology is applied for recovering signals at the receiver´s IO pads in a mission-mode configuration, from those measured at probe points in a probing configuration in real-time. It also offers physical insight into the interposer´s performance thus allowing for solution space exploration and meaningful comparisons of the two different interposer technologies to be presented.
Keywords :
integrated circuit packaging; system-on-chip; transfer functions; PoP configurations; PoP devices; SoC; de-embedding solution; interposer technology; mission-mode configuration; package-on-package; solution space exploration; transfer function methodology; Correlation; Integrated circuit modeling; Probes; Random access memory; Resistance; System-on-chip; Transfer functions; SoC; de-embedding; package-on-package (PoP); probing; transfer functions;
Conference_Titel :
Electromagnetic Compatibility (EMC), 2014 IEEE International Symposium on
Conference_Location :
Raleigh, NC
Print_ISBN :
978-1-4799-5544-2
DOI :
10.1109/ISEMC.2014.6899006