DocumentCode
236882
Title
A new tail-fit method design for jitter decomposition
Author
Chunchun Sui ; Beetner, Daryl G. ; Ting Zhu ; Cheng, C.-C.
Author_Institution
EMC Lab., Missouri Univ. of Sci. & Technol., Rolla, MO, USA
fYear
2014
fDate
4-8 Aug. 2014
Firstpage
423
Lastpage
427
Abstract
Although decreasing IC feature size and increasing I/O speed enable better system capability and performance, they also introduce technological challenges. One of the most important challenges is as I/O speed increases: jitter should decrease accordingly to ensure a reasonable bit error rate (BER) for a link system. Precise jitter characterization of signals at critical internal nodes provides valuable information for hardware fault diagnosis and next generation design. Understanding the separate contributions to jitter is challenging in this high speed industrial world. In this paper, Bounded Uncorrelated Jitter (BUJ), Random Jitter (RJ) and Periodic Jitter (PJ) are examined. A method is proposed to find BUJ in the presence of RJ, by first estimating RJ and then finding BUJ through de-convolution. A new tail-fit method is proposed to estimate the probability distribution for RJ. This new tail fit method is applicable for the general signal histogram, while the traditional tail fit method is only valid for the specific or ideal signal histogram.
Keywords
deconvolution; digital signal processing chips; error statistics; fault diagnosis; integrated circuit design; jitter; statistical distributions; BER; BUJ; I-O speed; IC feature size; PJ; RJ; bit error rate; bounded uncorrelated jitter; deconvolution; hardware fault diagnosis; jitter characterization; jitter decomposition; link system; next generation design; periodic jitter; probability distribution; random jitter; signal histogram; tail-fit method design; Clocks; Crosstalk; Gaussian distribution; Histograms; Jitter; Noise; Probability density function; Bounded Uncorrelated Jitter; de-convolution; jitter decomposition;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility (EMC), 2014 IEEE International Symposium on
Conference_Location
Raleigh, NC
Print_ISBN
978-1-4799-5544-2
Type
conf
DOI
10.1109/ISEMC.2014.6899009
Filename
6899009
Link To Document