DocumentCode
2368853
Title
Investigating the relationship between fingerprint image quality and skin characteristics
Author
Blomeke, Christine R. ; Modi, Shimon K. ; Elliott, Stephen J.
Author_Institution
Performance & Assurance Lab., Purdue Univ., West Lafayette, IN
fYear
2008
fDate
13-16 Oct. 2008
Firstpage
158
Lastpage
161
Abstract
This paper reports the correlations between skin characteristics, such as moisture, oiliness, elasticity, and temperature of the skin, and fingerprint image quality across three sensing technologies. Fingerprint images from the index finger of the dominant hand of 190 individuals, were collected on nine different fingerprint sensors. The sensors included four capacitance sensors, four optical sensors and one thermal fingerprint sensor. Skin characteristics included temperature, moisture, oiliness and elasticity, were measured prior to the initial interaction with each of the individual sensors. The analysis of the full dataset indicated that the sensing technology and interaction type (swipe or touch) were moderately and weakly correlated respectively with image quality scores. Correlation analysis between image quality scores and the skin characteristics were also made on subsets of data, divided by the sensing technology. The results did not identify any significant correlations. This indicates that further work is necessary to determine the type of relationship between the variables, and how they impact image quality and matching performance.
Keywords
fingerprint identification; image matching; image sensors; correlation analysis; fingerprint image quality; image matching; skin characteristics; Capacitive sensors; Fingerprint recognition; Image matching; Image quality; Moisture; Optical sensors; Sensor phenomena and characterization; Skin; Temperature sensors; Thermal sensors; ANOVA; biometrics; fingerprint image quality; skin characteristics;
fLanguage
English
Publisher
ieee
Conference_Titel
Security Technology, 2008. ICCST 2008. 42nd Annual IEEE International Carnahan Conference on
Conference_Location
Prague
Print_ISBN
978-1-4244-1816-9
Electronic_ISBN
978-1-4244-1817-6
Type
conf
DOI
10.1109/CCST.2008.4751295
Filename
4751295
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