• DocumentCode
    236887
  • Title

    Signal integrity optimization of MLVDS based multi-master instrument bus

  • Author

    Kaichen Song ; Caixia Li ; Lingyun Ye ; Chen, Bing ; Hereid, Ayonga

  • Author_Institution
    Coll. of Biomed. Eng. & Instrum. Sci., Zhejiang Univ., Hangzhou, China
  • fYear
    2014
  • fDate
    4-8 Aug. 2014
  • Firstpage
    433
  • Lastpage
    437
  • Abstract
    In this paper, we proposed a MLVDS based multimaster real time instrument bus to simultaneously satisfy the requirement of high speed data transmission and low latency. A variety of approaches, such as characteristic impedance matching, termination matching, backplane layout design and isolation of MLVDS differential signals, are taken to optimize its signal integrity. Both the simulation and experiment results manifest that, the transmit rate of the proposed bus can reach 900Mbps (up to 1800Mbps).
  • Keywords
    data communication; field buses; impedance matching; MLVDS based multimaster instrument bus; MLVDS differential signal isolation; backplane layout design; high speed data transmission; impedance matching; multipoint low voltage differential signaling; signal integrity optimization; termination matching; Backplanes; Connectors; Impedance; Instruments; Load modeling; Microstrip; Transceivers; high-speed; multi-master instrument bus; signal integrity; simulation; termination;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (EMC), 2014 IEEE International Symposium on
  • Conference_Location
    Raleigh, NC
  • Print_ISBN
    978-1-4799-5544-2
  • Type

    conf

  • DOI
    10.1109/ISEMC.2014.6899011
  • Filename
    6899011