DocumentCode
236887
Title
Signal integrity optimization of MLVDS based multi-master instrument bus
Author
Kaichen Song ; Caixia Li ; Lingyun Ye ; Chen, Bing ; Hereid, Ayonga
Author_Institution
Coll. of Biomed. Eng. & Instrum. Sci., Zhejiang Univ., Hangzhou, China
fYear
2014
fDate
4-8 Aug. 2014
Firstpage
433
Lastpage
437
Abstract
In this paper, we proposed a MLVDS based multimaster real time instrument bus to simultaneously satisfy the requirement of high speed data transmission and low latency. A variety of approaches, such as characteristic impedance matching, termination matching, backplane layout design and isolation of MLVDS differential signals, are taken to optimize its signal integrity. Both the simulation and experiment results manifest that, the transmit rate of the proposed bus can reach 900Mbps (up to 1800Mbps).
Keywords
data communication; field buses; impedance matching; MLVDS based multimaster instrument bus; MLVDS differential signal isolation; backplane layout design; high speed data transmission; impedance matching; multipoint low voltage differential signaling; signal integrity optimization; termination matching; Backplanes; Connectors; Impedance; Instruments; Load modeling; Microstrip; Transceivers; high-speed; multi-master instrument bus; signal integrity; simulation; termination;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility (EMC), 2014 IEEE International Symposium on
Conference_Location
Raleigh, NC
Print_ISBN
978-1-4799-5544-2
Type
conf
DOI
10.1109/ISEMC.2014.6899011
Filename
6899011
Link To Document