DocumentCode :
236892
Title :
Simulation and analysis for power frequency electric field of building close to power transmission lines
Author :
Bin Yang ; Shuhong Wang ; Qiang Wang ; Han Du ; Youpeng Huangfu
Author_Institution :
State Key Lab. of Electr. Insulation & Power Equip., Xi´an Jiaotong Univ., Xi´an, China
fYear :
2014
fDate :
4-8 Aug. 2014
Firstpage :
451
Lastpage :
454
Abstract :
Based on the design demands of the 330kV overhead transmission lines, the power frequency electric field for the power transmission lines near and over the building is simulated and analyzed in this paper. The 3-dimentional (3D) Finite Element Method (FEM) is employed to analyze the distribution of the electric field at the level of 1.5m above the ground around and inside a typical building model. The influences on electric field distribution of building located near and under the line are considered. A three-floor building model, which can be constructed with different materials, is proposed. The computational results show the shielding effect on the electric field distribution of the building and large electric field distortion near the outline of the building. The influence on the electric field intensity of the material of the building, the transmission line height, the number of the floors and the orientation of the window is respectively discussed, which can provide important references for the design and construction of the power transmission lines.
Keywords :
buildings (structures); distortion; electromagnetic shielding; finite element analysis; power overhead lines; 3-dimentional finite element method; electric field distortion; electric field distribution; electric field intensity; overhead transmission lines; power frequency electric field; power transmission lines; shielding effect; three-floor building model; transmission line height; voltage 330 kV; Concrete; Electric fields; Floors; Power transmission lines; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility (EMC), 2014 IEEE International Symposium on
Conference_Location :
Raleigh, NC
Print_ISBN :
978-1-4799-5544-2
Type :
conf
DOI :
10.1109/ISEMC.2014.6899014
Filename :
6899014
Link To Document :
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