• DocumentCode
    2369067
  • Title

    Development of ESD protection structures for BULK and SOI BCD6 technology

  • Author

    Tazzoli, A. ; Cerati, L. ; Dissegna, M. ; Andreini, A. ; Zanoni, E. ; Meneghesso, G.

  • Author_Institution
    DEI, Padova Univ.
  • fYear
    2006
  • fDate
    4-8 June 2006
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    ESD protection elements for 0.35mum smart power technology on SOI substrate are investigated, considering bulk technology as a reference. Heat dissipation issue, due to oxide isolation, is analyzed at simulation level. Starting from simulation results, proper sizing and ESD robustness verification are presented
  • Keywords
    electrostatic discharge; power integrated circuits; silicon-on-insulator; 0.35 micron; SOI BCD6 technology; SOI substrate; electrostatic discharge protection; heat dissipation; oxide isolation; smart power technology; Analytical models; Biological system modeling; CMOS technology; Clamps; Electrostatic discharge; Isolation technology; Protection; Robustness; Silicon; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices and IC's, 2006. ISPSD 2006. IEEE International Symposium on
  • Conference_Location
    Naples
  • Print_ISBN
    0-7803-9714-2
  • Type

    conf

  • DOI
    10.1109/ISPSD.2006.1666146
  • Filename
    1666146
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2369067