• DocumentCode
    2369107
  • Title

    Rational design of molecular self-assemblies: A platform for nanotechnology

  • Author

    Bleger, D. ; Mathevet, Fabrice ; Kreher, David ; Attias, André-Jean ; Schull, Guillaume ; Douillard, Ludovic ; Fiorini-Debuisschert, Céline ; Charra, Fabrice

  • Author_Institution
    Lab. de Chimie Macromoleculaire, Univ. Pierre et Marie Curie, Paris
  • fYear
    2008
  • fDate
    24-27 March 2008
  • Firstpage
    906
  • Lastpage
    908
  • Abstract
    In order to create surface patterns, planar molecules with extended pi-conjugated systems have found particularly wide use because they tend to bond in a flat-lying geometry, which allows functional groups at the molecule periphery to approach each other easily and to engage into non covalent interactions, predominantly hydrogen bonds [J.V. Barth et al., 2005]. In this work, we developed an original approach, based on a new molecular unit designed both in order to act as a functional group used as a dasiaclippsila between neighboring molecules, and to pattern 2D supra-molecular architectures into specific arrangements. The opportunity to reach multiple and tunable topologies is evidenced by using scanning tunneling microscopy (STM). All these results allow to establish molecular engineering rules for designing new nanostructures, opening interesting perspectives for applications in various domains of nanotechnology such as nanoelectronics.
  • Keywords
    nanotechnology; self-assembly; molecular engineering rules; molecular self-assemblies; molecule periphery; nanostructures; nanotechnology platform; noncovalent interaction; planar molecules; scanning tunneling microscopy; surface pattern; Bonding; Design engineering; Geometry; Hydrogen; Microscopy; Nanostructures; Nanotechnology; Self-assembly; Topology; Tunneling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanoelectronics Conference, 2008. INEC 2008. 2nd IEEE International
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-1572-4
  • Electronic_ISBN
    978-1-4244-1573-1
  • Type

    conf

  • DOI
    10.1109/INEC.2008.4585630
  • Filename
    4585630