DocumentCode :
2369132
Title :
Overview of the US EU MRA negotiations [EMC regulations]
Author :
Wall, Art ; Knapp, Julius P.
Author_Institution :
Equipment Authorization Div., Fed. Commun. Comm., Columbia, MD, USA
fYear :
1997
fDate :
18-22 Aug 1997
Firstpage :
29
Lastpage :
32
Abstract :
For the last three years, the United States government and the European Union have been negotiating a Mutual Recognition Agreement for conformity assessment. These negotiations are limited to specific equipment sectors and to conformity assessment. The product sectors that may be included in the Agreement include: telecommunication equipment; pharmaceuticals; medical devices; recreational crafts; and others. The FCC participated in these negotiations for telecommunications and EMC at the request of the US industry, the office of the United States trade representative and the Department of Commerce, who are leading these negotiations for the USG. The agreement, which is expected to be signed by both parties in 1997, will allow for these two sectors, US manufacturers and laboratories, to test and approve in the United States certain telecommunications equipment bound for the European market. Conversely, European manufacturers will be allowed to test and approve in Europe similar equipment bound for the US market. This paper provides an overview of these negotiations from the FCC perspective and outlines a number of the steps the US Government and the FCC must take to implement the agreement
Keywords :
electromagnetic compatibility; international trade; legislation; telecommunication equipment; telecommunication standards; EMC regulations; European Union; Mutual Recognition Agreement; US Government; USA; conformity assessment; negotiations; telecommunications equipment; Communication industry; Electromagnetic compatibility; Europe; FCC; Laboratories; Manufacturing industries; Pharmaceuticals; Testing; US Department of Commerce; US Government;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility, 1997. IEEE 1997 International Symposium on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-4140-6
Type :
conf
DOI :
10.1109/ISEMC.1997.667535
Filename :
667535
Link To Document :
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