• DocumentCode
    2369345
  • Title

    Study on path-optimization by grade for sorting dies

  • Author

    Wu, Tao ; Li, Bin ; Wang, Longwen ; Huang, Yu

  • Author_Institution
    Nat. Numerical Control Syst. Eng. Res. Center, Huazhong Univ. of Sci. & Technol., Wuhan, China
  • fYear
    2010
  • fDate
    4-7 Aug. 2010
  • Firstpage
    876
  • Lastpage
    880
  • Abstract
    Semiconductor light-emitting die (LED) has now become one of the most popular lighting devices. Before dies are put into process of package, they need be inspected and sorted strictly, so following waste will be saved. Cost of inspection and sort is relatively high, it is urgently needed to improve sort efficiency and reduce sort time. To get efficient solution, detailed view of working flow is presented to make analysis on performance and its influenced factors. It can be revealed that positioning of recycle bins is the major influence factor. Performance may decrease by 3.2 to 0.9 dies per second. Because of this, a path optimization method according grade priority is put forward. In this way, the dies with same grade should get priority to be sorted first. Techniques about die search and merge by grade, traversal of forward and backtrack with cross priority are described in detail. With results of reasonable simulations and a case experiment, this optimization is proved highly effective to reduce sort time and improve dies production rate.
  • Keywords
    inspection; light emitting diodes; semiconductor device manufacture; semiconductor device packaging; sorting; die search; dies production rate improvement; dies sorting; inspection cost; lighting devices; packaging process; path optimization method; semiconductor light emitting die; Lenses; Light emitting diodes; Machine vision; Optimization; Production; Recycling; Sorting; auto-path planning; die sorter; light emitting dies; merge by grade; performance evaluation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mechatronics and Automation (ICMA), 2010 International Conference on
  • Conference_Location
    Xi´an
  • ISSN
    2152-7431
  • Print_ISBN
    978-1-4244-5140-1
  • Electronic_ISBN
    2152-7431
  • Type

    conf

  • DOI
    10.1109/ICMA.2010.5589000
  • Filename
    5589000