DocumentCode
2369345
Title
Study on path-optimization by grade for sorting dies
Author
Wu, Tao ; Li, Bin ; Wang, Longwen ; Huang, Yu
Author_Institution
Nat. Numerical Control Syst. Eng. Res. Center, Huazhong Univ. of Sci. & Technol., Wuhan, China
fYear
2010
fDate
4-7 Aug. 2010
Firstpage
876
Lastpage
880
Abstract
Semiconductor light-emitting die (LED) has now become one of the most popular lighting devices. Before dies are put into process of package, they need be inspected and sorted strictly, so following waste will be saved. Cost of inspection and sort is relatively high, it is urgently needed to improve sort efficiency and reduce sort time. To get efficient solution, detailed view of working flow is presented to make analysis on performance and its influenced factors. It can be revealed that positioning of recycle bins is the major influence factor. Performance may decrease by 3.2 to 0.9 dies per second. Because of this, a path optimization method according grade priority is put forward. In this way, the dies with same grade should get priority to be sorted first. Techniques about die search and merge by grade, traversal of forward and backtrack with cross priority are described in detail. With results of reasonable simulations and a case experiment, this optimization is proved highly effective to reduce sort time and improve dies production rate.
Keywords
inspection; light emitting diodes; semiconductor device manufacture; semiconductor device packaging; sorting; die search; dies production rate improvement; dies sorting; inspection cost; lighting devices; packaging process; path optimization method; semiconductor light emitting die; Lenses; Light emitting diodes; Machine vision; Optimization; Production; Recycling; Sorting; auto-path planning; die sorter; light emitting dies; merge by grade; performance evaluation;
fLanguage
English
Publisher
ieee
Conference_Titel
Mechatronics and Automation (ICMA), 2010 International Conference on
Conference_Location
Xi´an
ISSN
2152-7431
Print_ISBN
978-1-4244-5140-1
Electronic_ISBN
2152-7431
Type
conf
DOI
10.1109/ICMA.2010.5589000
Filename
5589000
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