DocumentCode
2369635
Title
3D device simulation of work function and interface trap fluctuations on high-κ / metal gate devices
Author
Cheng, Hui-Wen ; Fu-Hai Li ; Han, Ming-Hung ; Yiu, Chun-Yen ; Yu, Chia-Hui ; Lee, Kuo-Fu ; Li, Fu-Hai
Author_Institution
Inst. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
fYear
2010
fDate
6-8 Dec. 2010
Abstract
This work, for the first time, examines the work function fluctuation (WKF) and interface trap fluctuation (ITF) using experimentally calibrated 3D device simulation on high-κ/metal gate technology. The random WKs result in 36.7 mV threshold voltage fluctuation (σVth) for 16 nm N-MOSFETs with TiN gate, which is rather different from the result of averaged WKF (AWKF) method [1] due to localized random WK effect. The ITF affects the subthreshold region (the normalized σID >; 48%) and is suppressed for devices under strong inversion. Estimation of statistical covariance confirms the dependence of IT on the metal gate´s WK; thus, the impacts of WKF and ITF on device and circuit variability should be considered together properly. Such variability induced static noise margin fluctuation of SRAM exceeds the influence of random dopants and cannot be ignored.
Keywords
MOSFET; SRAM chips; covariance analysis; current fluctuations; high-k dielectric thin films; titanium compounds; work function; 3D device simulation; N-MOSFET; SRAM; TiN; high-k/metal gate devices; interface trap fluctuations; localized random WK effect; size 16 nm; static noise margin fluctuation; statistical covariance; voltage 36.7 mV; voltage fluctuation; work function fluctuation;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting (IEDM), 2010 IEEE International
Conference_Location
San Francisco, CA
ISSN
0163-1918
Print_ISBN
978-1-4424-7418-5
Electronic_ISBN
0163-1918
Type
conf
DOI
10.1109/IEDM.2010.5703370
Filename
5703370
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