• DocumentCode
    2369635
  • Title

    3D device simulation of work function and interface trap fluctuations on high-κ / metal gate devices

  • Author

    Cheng, Hui-Wen ; Fu-Hai Li ; Han, Ming-Hung ; Yiu, Chun-Yen ; Yu, Chia-Hui ; Lee, Kuo-Fu ; Li, Fu-Hai

  • Author_Institution
    Inst. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • fYear
    2010
  • fDate
    6-8 Dec. 2010
  • Abstract
    This work, for the first time, examines the work function fluctuation (WKF) and interface trap fluctuation (ITF) using experimentally calibrated 3D device simulation on high-κ/metal gate technology. The random WKs result in 36.7 mV threshold voltage fluctuation (σVth) for 16 nm N-MOSFETs with TiN gate, which is rather different from the result of averaged WKF (AWKF) method [1] due to localized random WK effect. The ITF affects the subthreshold region (the normalized σID >; 48%) and is suppressed for devices under strong inversion. Estimation of statistical covariance confirms the dependence of IT on the metal gate´s WK; thus, the impacts of WKF and ITF on device and circuit variability should be considered together properly. Such variability induced static noise margin fluctuation of SRAM exceeds the influence of random dopants and cannot be ignored.
  • Keywords
    MOSFET; SRAM chips; covariance analysis; current fluctuations; high-k dielectric thin films; titanium compounds; work function; 3D device simulation; N-MOSFET; SRAM; TiN; high-k/metal gate devices; interface trap fluctuations; localized random WK effect; size 16 nm; static noise margin fluctuation; statistical covariance; voltage 36.7 mV; voltage fluctuation; work function fluctuation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting (IEDM), 2010 IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0163-1918
  • Print_ISBN
    978-1-4424-7418-5
  • Electronic_ISBN
    0163-1918
  • Type

    conf

  • DOI
    10.1109/IEDM.2010.5703370
  • Filename
    5703370