• DocumentCode
    2369774
  • Title

    Thermal-aware design of 3D ICs with inter-tier liquid cooling

  • Author

    Atienza, David

  • Author_Institution
    Embedded Syst. Lab. (ESL), Ecole Polytech. Fed. de Lausanne (EPFL), Lausanne, Switzerland
  • fYear
    2010
  • fDate
    6-8 Dec. 2010
  • Abstract
    Microchannel-based liquid cooling is a promising technology solution to overcome the thermal challenges of 3D MPSoCs. However, intelligent control of the coolant flow rate is needed to avoid wasted energy consumption for over-cooling the system when the system is under-utilized. Therefore, this paper proposes a novel system-level thermal-aware design as an affective method to achieve thermally-balanced 3D MPSoCs.
  • Keywords
    integrated circuit design; multiprocessing systems; system-on-chip; thermal management (packaging); three-dimensional integrated circuits; 3D IC; 3D MPSoC; coolant flow rate; intertier liquid cooling; microchannel-based liquid cooling; system-level thermal-aware design;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting (IEDM), 2010 IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0163-1918
  • Print_ISBN
    978-1-4424-7418-5
  • Electronic_ISBN
    0163-1918
  • Type

    conf

  • DOI
    10.1109/IEDM.2010.5703379
  • Filename
    5703379
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2369774