• DocumentCode
    2369810
  • Title

    Device and circuit interactive design and optimization beyond the conventional scaling era

  • Author

    Oh, Saeroonter ; Wei, Lan ; Chong, Soogine ; Luo, Jieying ; Wong, H. S Philip

  • Author_Institution
    Dept. of Electr. Eng., Stanford Univ., Stanford, CA, USA
  • fYear
    2010
  • fDate
    6-8 Dec. 2010
  • Abstract
    Summary form only given. Miniaturization of device feature size has improved both device density and device performance in the conventional scaling era. However, degradation of electrostatic gate control, increasing contribution of parasitics, and increasing power consumption have limited scalability. The slow-down of Lg scaling has been compensated for by technology features such as strain engineering, high-κ dielectric, and novel channel materials and device structures. Looking forward, new trends for device design are expected. Particularly, considerable amount of attention is needed in 1) parasitics, and 2) understanding device design and its impact on the circuit-level environment. For advanced technologies and emerging devices, technology development and device design has to be revisited, as conventional methods of performance benchmarking are unable to capture the system-level power-constrained circuit design tradeoffs. In this paper, several issues on technology development are further addressed based on the study of device and circuit interactive design and optimization.
  • Keywords
    semiconductor device models; circuit interactive design; circuit-level environment; device density; device design; device feature size; device performance; electrostatic gate control; miniaturization; system-level power-constrained circuit design; technology development;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting (IEDM), 2010 IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0163-1918
  • Print_ISBN
    978-1-4424-7418-5
  • Electronic_ISBN
    0163-1918
  • Type

    conf

  • DOI
    10.1109/IEDM.2010.5703380
  • Filename
    5703380