• DocumentCode
    2369990
  • Title

    Fabrication and magnetic properties of metal nanowires via AAO templates

  • Author

    Thongmee, S. ; Pang, H.L. ; Ding, J. ; Yi, J.B. ; Lin, J.Y.

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Nat. Univ. of Singapore, Singapore
  • fYear
    2008
  • fDate
    24-27 March 2008
  • Firstpage
    1116
  • Lastpage
    1120
  • Abstract
    Metals (Ni, Co, Cu and Fe) nanowires were fabricated by electrodeposition onto anodic aluminum oxide (AAO) template. In this work, we have studied the effect of the electrode potential on the microstructure and magnetic properties of nanowires. TEM results showed that Cu, Co and Ni nanowires were single crystal. Cu and Ni nanowires had the same orientation along the [220] direction, while Co had a preferred orientation along [100] direction. The growth mechanisms are probably due to the competition growth of the adjacent grains and the confinement of growth in the nano-sized hole of the AAO template. Single crystal Fe nanowires could not be formed by the application of different potentials. Ni, Co and Fe showed good magnetic properties. The coercivities up to 1.3 kOe and 1.6 kOe were obtained in Co and Fe nanowires with high remanence ratios 79.7% and 84.8% for Co and Fe, respectively. The remanence ratio of Ni was 97.9%.
  • Keywords
    cobalt; coercive force; copper; electrodeposition; iron; nanotechnology; nanowires; nickel; remanence; texture; transmission electron microscopy; AAO templates; Co; Cu; Fe; Ni; TEM; anodic aluminum oxide; coercivity; electrodeposition; magnetic properties; metal nanowires; microstructure; nanowires fabrication; preferred orientation; remanence; Aluminum oxide; Coercive force; Crystal microstructure; Electrodes; Fabrication; Iron; Magnetic confinement; Magnetic properties; Nanowires; Remanence;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nanoelectronics Conference, 2008. INEC 2008. 2nd IEEE International
  • Conference_Location
    Shanghai
  • Print_ISBN
    978-1-4244-1572-4
  • Electronic_ISBN
    978-1-4244-1573-1
  • Type

    conf

  • DOI
    10.1109/INEC.2008.4585678
  • Filename
    4585678