DocumentCode :
2370040
Title :
DFM: linking design and manufacturing
Author :
Raghvendra, Srinivas ; Hurat, Philippe
Author_Institution :
Synopsys, Inc., Mountain View, CA, USA
fYear :
2005
fDate :
3-7 Jan. 2005
Firstpage :
705
Lastpage :
708
Abstract :
Until the move to the 130nm node, yield was an issue only for product engineers and engineers on the production line. Design engineers did not need to think explicitly about yield, or understand the manufacturing process. Beginning at the 130nm node, yield has become more problematic, and the defect mechanisms that contribute to yield loss are very different. Where random defects used to be dominant, we now have defects due to lithographic issues, and pattern (or design) dependent issues. This paper explains how these latter defect mechanisms differ from random defects and how and why the design engineer needs to become involved to mitigate the problem. On the lithography topic, this paper briefly examines techniques such as OPC (optical proximity correction) and PSM (phase shift masking), and explain their design and yield impact. We also examine issues such as dummy metal fill for CMP, redundant via insertion, as ways to mitigate pattern dependent yield issues.
Keywords :
chemical mechanical polishing; integrated circuit yield; manufacturing processes; nanolithography; nanopatterning; phase shifting masks; proximity effect (lithography); CMP; DFM; defect mechanisms; dummy metal fill; lithographic defects; manufacturing process; optical proximity correction; pattern dependent yield; phase shift masking; production line; random defects; yield impact; yield loss; Design engineering; Design for manufacture; Joining processes; Lithography; Manufacturing processes; Optical design; Optical design techniques; Process design; Production; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Design, 2005. 18th International Conference on
ISSN :
1063-9667
Print_ISBN :
0-7695-2264-5
Type :
conf
DOI :
10.1109/ICVD.2005.80
Filename :
1383357
Link To Document :
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