DocumentCode :
2370103
Title :
Metal oxide RRAM switching mechanism based on conductive filament microscopic properties
Author :
Bersuker, G. ; Gilmer, D.C. ; Veksler, D. ; Yum, J. ; Park, H. ; Lian, S. ; Vandelli, L. ; Padovani, A. ; Larcher, L. ; McKenna, K. ; Shluger, A. ; Iglesias, V. ; Porti, M. ; Nafría, M. ; Taylor, W. ; Kirsch, P.D. ; Jammy, R.
fYear :
2010
fDate :
6-8 Dec. 2010
Abstract :
By combining electrical, physical, and transport/atomistic modeling results, this study identifies critical conductive filament features controlling TiN/HfO2/TiN resistive memory operations. The forming process is found to define the filament geometry, which in turn determines the temperature profile and, consequently, the switching characteristics. The findings point to the critical importance of controlling filament dimensions during the forming process (polarity, max current/voltage, etc.).
Keywords :
grain boundaries; hafnium compounds; leakage currents; random-access storage; titanium compounds; TiN-HfO2-TiN; conductive filament microscopic properties; filament geometry; grain boundaries; leakage current; metal oxide RRAM switching; temperature profile;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting (IEDM), 2010 IEEE International
Conference_Location :
San Francisco, CA
ISSN :
0163-1918
Print_ISBN :
978-1-4424-7418-5
Electronic_ISBN :
0163-1918
Type :
conf
DOI :
10.1109/IEDM.2010.5703394
Filename :
5703394
Link To Document :
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