• DocumentCode
    2370263
  • Title

    Effect of sidechain anisotropy on residue contact determination

  • Author

    Sun, Weitao ; He, Jing

  • Author_Institution
    Zhou Pei-Yuan Center for Appl. Math., Tsinghua Univ., Beijing, China
  • fYear
    2009
  • fDate
    1-4 Nov. 2009
  • Firstpage
    181
  • Lastpage
    188
  • Abstract
    The criteria used to determine the residue contact is a fundamental factor in deriving knowledge-based mean force potential energy for protein structures. A commonly used criterion for two residues in contact is to require the sidechain center distance or the Calpha atom distance to be within a predetermined cutoff distance. However, the anisotropic nature of the sidechains can result in error in the counting of the contact pairs. This study compared three sidechain contact models: the surface-to-surface model based on atom distance criteria (ADC), the isotropic sphere sidechain (ISS) model and the anisotropic ellipsoid sidechain (AES) model. A test using 424 high resolution protein structures from the Protein Data Bank suggests that the ADC model is the most accurate and the AES eliminate about half of the incorrectly counted contact pairs when this model is compared to the ISS model.
  • Keywords
    bioinformatics; knowledge based systems; molecular configurations; proteomics; very large databases; AES model; ISS model; Protein Data Bank; anisotropic ellipsoid sidechain model; atom distance criteria; contact pair counting; cutoff distance; isotropic sphere sidechain model; knowledge based mean force potential energy; protein structure mean force potential energy; residue contact determination; sidechain anisotropy effects; sidechain center distance; surface to surface model; Amino acids; Anisotropic magnetoresistance; Atomic measurements; Computer science; Ellipsoids; Geometry; Mathematics; Potential energy; Protein engineering; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Bioinformatics and Biomedicine Workshop, 2009. BIBMW 2009. IEEE International Conference on
  • Conference_Location
    Washington, DC
  • Print_ISBN
    978-1-4244-5121-0
  • Type

    conf

  • DOI
    10.1109/BIBMW.2009.5332123
  • Filename
    5332123