Title :
SI-PI cosimulation analysis of dual referencing and VSS-Referencing memory bus
Author :
Lai, Mingyong ; Srinivasan, K. ; Chakraborty, Rupak ; Seshadhri, Madhumita
Author_Institution :
Intel Corp., DuPont, WA, USA
Abstract :
Assessing the I/O performance delta between dual-referencing and ground-referencing schemes is needed to enable a lower layer count on either board or package, thereby reducing the overall platform cost. Existing methodologies attempted in quantifying impact simultaneously on both PI (Power Integrity) and SI (Signal Integrity) [1], [2] although the work is usually focused on I/O power delivery impact and rarely on actually quantifying impact of different referencing schemes [1]. An initial comparison between different referencing schemes on PKG (package) and BRD (board) has been performed. Then a further analysis has been performed to characterize a PKG with Dual referencing and VSS-Referencing.
Keywords :
electromagnetic compatibility; electronics packaging; printed circuits; BRD; I/O performance delta assessment; I/O power delivery; PKG; SI-PI cosimulation analysis; VSS-referencing memory bus; board; dual referencing scheme; ground-referencing schemes; package; platform cost; power integrity; signal integrity; Correlation; Couplings; Noise; Silicon; Solid modeling; Three-dimensional displays; Tin; 2D/3D hybrid simulation; DoE; PDA; Power Integrity; Signal Integrity; dual referencing; ground-referencing;
Conference_Titel :
Electromagnetic Compatibility (EMC), 2014 IEEE International Symposium on
Conference_Location :
Raleigh, NC
Print_ISBN :
978-1-4799-5544-2
DOI :
10.1109/ISEMC.2014.6899081