Title :
Thermal Analysis of Novel Helix TWTs
Author :
Yao, Lieming ; Yang, Zhonghai ; Li, Bin ; Liao, Li ; Zeng, Baoqing ; Zhu, Xiaofang
Author_Institution :
Inst. of High Energy Electron., Univ. of Electron. Sci. & Technol. of China
Abstract :
Consider the thermal contact resistance and the thermal conductivity as the function of temperature, the power dissipation of BeO and diamond-supported, the diamond-studded and the full-diamond helical slow-wave structures (HSWS) are computed using ANSYS. Results indicated the studded-diamond circuit is better than the diamond-support circuit. Especially, the full diamond circuit demonstrated advantage of excellent heat removing
Keywords :
beryllium compounds; contact resistance; diamond; helical waveguides; slow wave structures; thermal analysis; thermal conductivity; BeO; diamond-support circuit; full diamond circuit; full-diamond helical slow-wave structures; helix travelling wave tubes; studded-diamond circuit; thermal analysis; thermal conductivity; thermal contact resistance; Circuit testing; Computational modeling; Conducting materials; Contact resistance; Copper; Electrical resistance measurement; Power dissipation; Temperature measurement; Thermal conductivity; Thermal resistance; ANSYS; TWT; diamond; thermal contact resistance;
Conference_Titel :
Vacuum Electronics Conference, 2006 held Jointly with 2006 IEEE International Vacuum Electron Sources., IEEE International
Conference_Location :
Monterey, CA
Print_ISBN :
1-4244-0108-9
DOI :
10.1109/IVELEC.2006.1666223
