DocumentCode :
237044
Title :
Parallel power grid analysis using distributed direct linear solver
Author :
Qing He ; Au, William ; Korobkov, Alexander ; Venkateswaran, Subramanian
Author_Institution :
Oracle Corp., USA
fYear :
2014
fDate :
4-8 Aug. 2014
Firstpage :
866
Lastpage :
871
Abstract :
Accurate and efficient power grid analysis has become increasingly important in semiconductors chip design and verification. It is one of the most computationally challenging tasks in high performance processor design analysis. Due to the extremely large memory required to store and manipulate the design data, it is no longer possible to accommodate the analysis using one or more serial processes on a single computer. The proposed method of large scale power grid analysis with sparse linear solver effectively distributes the computing tasks across multiple processes running on different computers within the network. It provides a stable, accurate, and scalable solution for the future process technology and design generations. The implementation incorporates advanced packages for matrix ordering, matrix factorization and solution, and message passing interface (MPI) integrated into the software tool capable of simulating extremely large scale design with billions of devices. The method can be applied to the power grid of arbitrary size and configuration, and produces results with SPICE-like accuracy. The benchmark analysis runs applied to the largest blocks of the latest Sparc processor design using 16 distributed processes demonstrate more than 6X memory utilization improvement and 9X performance improvement over a state-of-the-art serial solution currently employed in semiconductor industry.
Keywords :
SPICE; VLSI; application program interfaces; circuit analysis computing; integrated circuit design; integrated circuit packaging; matrix decomposition; message passing; parallel processing; 6X memory utilization improvement; 9X performance improvement; MPI; SPICE-like accuracy; Sparc processor design; VLSI circuits; advanced packages; benchmark analysis; design generations; distributed direct linear solver; distributed processes; high performance processor design analysis; large scale power grid analysis; matrix factorization; matrix ordering; message passing interface; parallel power grid analysis; process technology; semiconductor chip design; semiconductor chip verification; semiconductor industry; single computer; software tool; sparse linear solver; Computational modeling; Computers; Memory management; Power grids; Runtime; Sparse matrices; Transient analysis; direct solver; parallel computing; power grid simulation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility (EMC), 2014 IEEE International Symposium on
Conference_Location :
Raleigh, NC
Print_ISBN :
978-1-4799-5544-2
Type :
conf
DOI :
10.1109/ISEMC.2014.6899089
Filename :
6899089
Link To Document :
بازگشت