DocumentCode :
2370440
Title :
Integrated VLSI layout compaction and wire balancing on a shared memory multiprocessor: evaluation of a parallel algorithm
Author :
Chalasani, Raghu P. ; Thulasiraman, K. ; Corneau, M.A.
Author_Institution :
Dept. of Electr. & Comput. Eng., Concordia Univ., Montreal, Que., Canada
fYear :
1994
fDate :
14-16 Dec 1994
Firstpage :
49
Lastpage :
56
Abstract :
We first present a unified formulation to three problems in VLSI physical design: layout compaction, wire balancing and integrated layout compaction and wire balancing problem. The aim of layout compaction is to achieve minimum chip width. Whereas wire balancing seeks to achieve minimum total wire length, integrated layout compaction and wire balancing seeks to minimize wire length maintaining the chip width at the optimum value. Our formulation is in terms of the dual transshipment problem. We then review our recent work on a parallel algorithm for the dual transshipment problem. We show how this algorithm called Modified Network Dual Simplex Method provides a unified approach to solve the three problems mentioned above and present experimental results. Our implementations have been on the BBN Butterfly machine. We draw attention to certain rather unusual results and argue that if the MNDS method is used then integrated layout compaction and wire balancing will achieve minimum chip width and a total wire length close to the optimum achieved by the wire balancing algorithm
Keywords :
VLSI; circuit layout; circuit layout CAD; parallel algorithms; shared memory systems; software performance evaluation; BBN Butterfly machine; VLSI layout compaction; dual transshipment problem; layout compaction; parallel algorithm; shared memory multiprocessor; wire balancing; Circuits; Compaction; Design automation; Network topology; Parallel algorithms; Parallel processing; Physics computing; Process design; Very large scale integration; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Parallel Architectures, Algorithms and Networks, 1994. (ISPAN), International Symposium on
Conference_Location :
Kanazawa
Print_ISBN :
0-8186-6507-6
Type :
conf
DOI :
10.1109/ISPAN.1994.367165
Filename :
367165
Link To Document :
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