• DocumentCode
    2370725
  • Title

    Non-contact THz probes for on-chip device and IC characterization

  • Author

    Trichopoulos, Georgios C. ; Topalli, Kagan ; Sertel, Kubilay

  • Author_Institution
    Dept. of ECE, Ohio State Univ., Columbus, OH, USA
  • fYear
    2012
  • fDate
    25-27 July 2012
  • Firstpage
    34
  • Lastpage
    35
  • Abstract
    We propose a contactless characterization approach for evaluating semiconductor devices and integrated circuits that operate in the THz regime (0.1-3 THz). The non-contact probe consists of on-chip receiving and transmitting THz antennas in a co-planar waveguide environment. Commercially available frequency extension modules with horn antennas are used in conjunction with microwave vector network analyzers to excite the proposed non-contact probe. A hemispherical lens couples the signals into device under test using the on-chip antennas. We discuss the calibration process and present the numerical evaluation of two non-contact probe schemes.
  • Keywords
    calibration; coplanar waveguides; horn antennas; integrated circuit testing; lens antennas; network analysers; probes; receiving antennas; semiconductor device testing; submillimetre wave integrated circuits; transmitting antennas; IC characterization; calibration process; commercial available frequency extension modules; contactless characterization approach; coplanar waveguide environment; device under test; frequency 0.1 THz to 3 THz; hemispherical lens; horn antennas; integrated circuits; microwave vector network analyzers; noncontact THz probe scheme; on-chip antennas; on-chip device; on-chip receiving THz antennas; semiconductor device evaluation; transmitting THz antennas; THz antennas; THz device characterization; mmW; sub-mmW;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Aerospace and Electronics Conference (NAECON), 2012 IEEE National
  • Conference_Location
    Dayton, OH
  • ISSN
    0547-3578
  • Print_ISBN
    978-1-4673-2791-6
  • Type

    conf

  • DOI
    10.1109/NAECON.2012.6531023
  • Filename
    6531023