• DocumentCode
    237081
  • Title

    Designing A 3D printing based channel emulator

  • Author

    Xiangyang Jiao ; Hui He ; Guanghua Li ; Wei Qian ; Guangyao Shen ; Pommerenke, David ; Chong Ding ; White, Douglas ; Scearce, Stephen ; Yaochao Yang

  • Author_Institution
    Missouri Univ. of Sci. & Technol., Rolla, MO, USA
  • fYear
    2014
  • fDate
    4-8 Aug. 2014
  • Firstpage
    956
  • Lastpage
    960
  • Abstract
    This research explored the possibility of building channel emulators by utilizing fused deposition modeling (FDM) 3D printing technology, which provides a rapid and low cost method with high flexibility to produce parts with many shapes of interest. Algorithms are developed for obtaining the printing pattern and loss profile based on S parameters of a target channel to be emulated. Parts with different dielectric constants, and loss tangents can be printed using filament with high dielectric constant or conductive fillers. Those parts will be placed on a low loss transmission line. As a result, different channel emulators can be built with the advantage of avoiding complicated electronic components, and only being limited in the frequency range by the base trace and its connectors.
  • Keywords
    S-parameters; dielectric losses; electromagnetic compatibility; microstrip lines; permittivity; rapid prototyping (industrial); three-dimensional printing; transmission lines; 3D printing based channel emulator; S parameters; conductive fillers; dielectric constants; fused deposition modeling; loss tangents; low loss transmission line; printing pattern; Dielectric constant; Dielectric losses; Dielectric measurement; Materials; Printing; Scattering parameters; Three-dimensional displays; 3D printing; FDM; channel emulator; dielectric constants; transmission line;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (EMC), 2014 IEEE International Symposium on
  • Conference_Location
    Raleigh, NC
  • Print_ISBN
    978-1-4799-5544-2
  • Type

    conf

  • DOI
    10.1109/ISEMC.2014.6899106
  • Filename
    6899106