• DocumentCode
    2370916
  • Title

    Cost effective 28nm LP SoC technology optimized with circuit/device/process co-design for smart mobile devices

  • Author

    Chidambaram, P.R. ; Gan, C. ; Sengupta, S. ; Ge, L. ; Chen, Y. ; Yang, S. ; Liu, P. ; Wang, J. ; Yang, M. ; Teng, C. ; Du, Y. ; Patel, P. ; Kamal, P. ; Bucki, R. ; Vang, F. ; Datta, A. ; Bellur, K. ; Yoon, S. ; Chen, N. ; Thean, A. ; Han, M. ; Terzioglu,

  • Author_Institution
    Qualcomm Inc., San Diego, CA, USA
  • fYear
    2010
  • fDate
    6-8 Dec. 2010
  • Abstract
    With newer technology nodes, circuit/device/process codesign is essential to realize the advantages of scaling. Leveraging co-design approach based on a well-established manufacturing flow, a cost effective 28 nm 4G SOC technology has been crafted. This 28 nm design strategy uses two sets of design rules and 7 different Vt cells with optimal power gating to achieve a 2.4× increase in gate density, 55% decrease in power and 30% gain in frequency with respect to the 45 nm counterpart. Relevant technical tradeoffs between the design/technology interactions are discussed to illustrate the codesign aspects.
  • Keywords
    mobile handsets; system-on-chip; 4G SoC technology; leveraging co-design approach; optimal power gating; size 28 nm; smart mobile devices;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting (IEDM), 2010 IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0163-1918
  • Print_ISBN
    978-1-4424-7418-5
  • Electronic_ISBN
    0163-1918
  • Type

    conf

  • DOI
    10.1109/IEDM.2010.5703432
  • Filename
    5703432