Title :
System in a package design of a RF front end system using application specific reduced order models
Author :
Nayak, Ghanshyam ; Washburn, Clyde ; Mukund, P.R.
Author_Institution :
Dept. of Electr. Eng., Rochester Inst. of Technol., NY, USA
Abstract :
´Package aware´ IC Design has not only become advantageous, but also essential towards optimum performance of high-end systems. This is specifically true in RF front-end systems where the circuit performance is highly sensitive to package parasitics. Here, an intuitive design methodology has been presented that can help in the package aware design of the RF front end system using reduced order models. The reduced order models, whose order is based on the application of the package pins, are generated using krylov´s sub space technique. This technique allows for a fine balance between the need for accuracy and time efficiency, during design and layout of the RF front-end.
Keywords :
circuit simulation; integrated circuit design; radiofrequency integrated circuits; system-on-chip; RF front end system; accuracy; application specific reduced order models; circuit performance; high-end systems; krylov sub space technique; package aware IC design; package parasitics; package pins application; system in a package design; time efficiency; Circuit optimization; Design methodology; Integrated circuit modeling; Packaging; Pins; Power system modeling; Radio frequency; Radiofrequency integrated circuits; Reduced order systems; Resonance;
Conference_Titel :
VLSI Design, 2005. 18th International Conference on
Print_ISBN :
0-7695-2264-5
DOI :
10.1109/ICVD.2005.159