• DocumentCode
    2371737
  • Title

    Ultra-high density carbon nanotubes on Al-Cu for advanced vias

  • Author

    Dijon, J. ; Okuno, H. ; Fayolle, M. ; Vo, T. ; Pontcharra, J. ; Acquaviva, D. ; Bouvet, D. ; Ionescu, A.M. ; Esconjauregui, C.S. ; Capraro, B. ; Quesnel, E. ; Robertson, J.

  • Author_Institution
    DTNM, CEA, Grenoble, France
  • fYear
    2010
  • fDate
    6-8 Dec. 2010
  • Abstract
    An integration scheme for carbon nanotube via interconnects is described to produce nanotube densities of 2.5 1012 tubes/cm2 or 8 1012 walls/cm2 on metallic Al-Cu lines, an order of magnitude beyond the previous state of art, and, for first time, close to that needed for implementation.
  • Keywords
    aluminium alloys; carbon nanotubes; copper alloys; interconnections; metallisation; Al-Cu; C; advanced nanotube via interconnects; ultrahigh density carbon nanotube;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting (IEDM), 2010 IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0163-1918
  • Print_ISBN
    978-1-4424-7418-5
  • Electronic_ISBN
    0163-1918
  • Type

    conf

  • DOI
    10.1109/IEDM.2010.5703470
  • Filename
    5703470
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2371737