Title :
Ultra-high density carbon nanotubes on Al-Cu for advanced vias
Author :
Dijon, J. ; Okuno, H. ; Fayolle, M. ; Vo, T. ; Pontcharra, J. ; Acquaviva, D. ; Bouvet, D. ; Ionescu, A.M. ; Esconjauregui, C.S. ; Capraro, B. ; Quesnel, E. ; Robertson, J.
Author_Institution :
DTNM, CEA, Grenoble, France
Abstract :
An integration scheme for carbon nanotube via interconnects is described to produce nanotube densities of 2.5 1012 tubes/cm2 or 8 1012 walls/cm2 on metallic Al-Cu lines, an order of magnitude beyond the previous state of art, and, for first time, close to that needed for implementation.
Keywords :
aluminium alloys; carbon nanotubes; copper alloys; interconnections; metallisation; Al-Cu; C; advanced nanotube via interconnects; ultrahigh density carbon nanotube;
Conference_Titel :
Electron Devices Meeting (IEDM), 2010 IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4424-7418-5
Electronic_ISBN :
0163-1918
DOI :
10.1109/IEDM.2010.5703470
