• DocumentCode
    2371952
  • Title

    Quantification of functional aalterations after in vitro traumatic brain injury

  • Author

    Yu, Zhe ; Elkin, Benjamin S. ; Morrison, Barclay

  • fYear
    2009
  • fDate
    3-6 Sept. 2009
  • Firstpage
    1135
  • Lastpage
    1138
  • Abstract
    Traumatic brain injury (TBI) is caused by mechanical forces, producing tissue deformation at the moment of injury. Complex cellular, neurochemical and metabolic alterations are initiated by the deformation and result in delayed cell death and dysfunction. Using an in vitro model of TBI based on organotypic brain slice cultures, we have quantitatively studied the relationship between tissue deformation and functional outcome. Specifically, we studied the effects of low levels of tissue deformation on the functional outcomes as measured by electrophysiology recordings. In response to 5% and 10% biaxial Lagrangian strain, the maximal evoked response and the excitability of neural networks were found to be decreased. Additionally, the different anatomic subregions of the hippocampus displayed different levels of impairment to the injuries. These results suggest that the network function was affected by low levels of applied strain which induced minimal cell death in previous studies.
  • Keywords
    biochemistry; bioelectric phenomena; biomechanics; brain; cellular biophysics; deformation; neurophysiology; wounds; biaxial Lagrangian strain; cell death; cell dysfunction; cellular alterations; electrophysiology recordings; evoked response; functional alterations; hippocampus; mechanical force; metabolic alterations; neural network excitability; neurochemical alterations; organotypic brain slice culture; tissue deformation; traumatic brain injury; Animals; Biomechanics; Brain Injuries; Electrophysiological Phenomena; Evoked Potentials; Hippocampus; Models, Neurological; Rats; Tissue Culture Techniques;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2009. EMBC 2009. Annual International Conference of the IEEE
  • Conference_Location
    Minneapolis, MN
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-3296-7
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/IEMBS.2009.5332381
  • Filename
    5332381