• DocumentCode
    2372682
  • Title

    Real-Time Constrained Task Scheduling in 3D Chip Multiprocessor to Reduce Peak Temperature

  • Author

    Li, Jiayin ; Qiu, Meikang ; Niu, Jianwei ; Chen, Tianzhou ; Zhu, Yongxin

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Kentucky, Lexington, KY, USA
  • fYear
    2010
  • fDate
    11-13 Dec. 2010
  • Firstpage
    170
  • Lastpage
    176
  • Abstract
    Chip multiprocessor technique has been implemented in embedded systems due to the tremendous computation requirements. Three dimension chip multiprocessor architecture has been studied recently for integrating more functionalities and providing higher performance. The high temperature on chip is a critical issue for the 3D architecture. In this paper, we propose an online thermal prediction model for 3D chip. Using this model, we present a task scheduling algorithm based on rotation scheduling to reduce the peak temperature on chip. We consider the data dependencies, especially the inter-iteration dependencies which are not well considered in most of the current thermal-aware task scheduling algorithms. Our simulation result shows that our algorithm can efficiently reduce the peak temperature up to 10°C.
  • Keywords
    embedded systems; microprocessor chips; processor scheduling; thermal management (packaging); 3D architecture; 3D chip multiprocessor technique; embedded systems; interiteration dependencies; online thermal prediction model; peak temperature reduction; real-time constrained task scheduling; rotation scheduling; Thermal-aware; peak temperature; real-time constraint; task scheduling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Embedded and Ubiquitous Computing (EUC), 2010 IEEE/IFIP 8th International Conference on
  • Conference_Location
    Hong Kong
  • Print_ISBN
    978-1-4244-9719-5
  • Electronic_ISBN
    978-0-7695-4322-2
  • Type

    conf

  • DOI
    10.1109/EUC.2010.33
  • Filename
    5703513