High-Level Embedded Passive Triplexer and Quintplexer Module into Organic Packaging Substrate

In this paper, fully embedded passive triplexer and quintplexer module into organic packaging substrate were presented for US CDMA handset applications. First, the passive triplexer was implemented by embedding all passive elements and circuits into multi-layered FR-4 packaging substrate and surface mounting GPS surface acoustic-wave (SAW) band pass filter on top of the organic packaging substrate. The passive triplexer circuit with 8 passive elements was comprised of a diplexer, parallel resonator, and matching network. The CDMA quintplexer module was fabricated by assembling the triplexer with DCN and PCS duplexers on FR-4 evaluation board. The sizes of the triplexer and quintplexer module were approximately 3 mm times 4 mm and 7 mm times 6 mm, respectively. These fabricated devices exhibited good performance characteristics, small size/volume, low cost, and high-level integrity onto a multi-layered organic packaging substrate. The simulated performance characteristics were agreed with the simulated ones.