Title :
Effects of adsorbed proteins, an antifouling agent and long-duration DC voltage pulses on the impedance of silicon-based neural microelectrodes
Author :
Sommakia, Salah ; Rickus, Jenna L. ; Otto, Kevin J.
Author_Institution :
Weldon Sch. of Biomed. Eng., Purdue Univ., West Lafayette, IN, USA
Abstract :
The successful use of implantable neural microelectrodes as neuroprosthetic devices depends on the mitigation of the reactive tissue response of the brain. One of the factors affecting the ultimate severity of the reactive tissue response and the in vivo electrical properties of the microelectrodes is the initial adsorption of proteins onto the surface of the implanted microelectrodes. In this study we quantify the increase in microelectrode impedance magnitude at physiological frequencies following electrode immersion in a 10% bovine serum albumin (BSA) solution. We also demonstrate the efficacy of a common antifouling molecule, poly(ethylene glycol) (PEG), in preventing a significant increase in microelectrode impedance. In addition, we show the feasibility of using long-duration DC voltage pulses to remove adsorbed proteins from the microelectrode surface.
Keywords :
biomedical electrodes; biomedical materials; brain; electric impedance measurement; microelectrodes; neurophysiology; prosthetics; proteins; BSA solution electrode immersion; adsorbed protein effects; antifouling agent effects; bovine serum albumin; brain reactive tissue response; implantable neural microelectrodes; long duration DC voltage pulse effects; microelectrode impedance magnitude; neuroprosthetic devices; polyethylene glycol; silicon based neural microelectrode impedance; Adsorption; Animals; Biomedical Engineering; Brain; Cattle; Electric Impedance; Electrodes, Implanted; Microelectrodes; Polyethylene Glycols; Prostheses and Implants; Serum Albumin, Bovine; Silicon;
Conference_Titel :
Engineering in Medicine and Biology Society, 2009. EMBC 2009. Annual International Conference of the IEEE
Conference_Location :
Minneapolis, MN
Print_ISBN :
978-1-4244-3296-7
Electronic_ISBN :
1557-170X
DOI :
10.1109/IEMBS.2009.5332456