Ultrasonic modification of Sn-Ag-Cu alloy microstructure

Author

Belyakov, Sergey A.

Author_Institution

Bauman Moscow State Tech. Univ., Moscow

fYear

2008

fDate

1-5 July 2008

Firstpage

58

Lastpage

59

Abstract

Near-eutectic ternary system Sn-Ag-Cu is becoming an evident choice in transition to lead-free technology in the microelectronic industry in view of numerous advantages comparing to other lead-free alternative solders. The present article investigates the principles of Sn-Ag-Cu alloy crystallization and ultrasonic influence on the nucleating alloy in order to optimize its microstructure. It has been shown that size, shape and quantity of intermetallic phases Ag₃Sn, Cu₆Sn₅ and a phase composition of the near-eutectic ternary system Sn-Ag-Cu is under ultrasonic frequency influence.

Keywords

copper alloys; crystallisation; integrated circuit technology; materials preparation; silver alloys; soldering; tin alloys; ultrasonic applications; Sn-Ag-Cu; alloy crystallization; alloy microstructure; intermetallic phase; lead-free soldering; lead-free technology; microelectronic industry; near-eutectic ternary system; nucleating alloy; phase composition; solder joint formation; ultrasonic frequency influence; ultrasonic modification; Copper alloys; Crystallization; Environmentally friendly manufacturing techniques; Frequency; Intermetallic; Lead; Microstructure; Soldering; Temperature; Thermomechanical processes; Near-eutectic ternary Sn-Ag-Cu alloy; microstructure; ultrasonic vibration;

fLanguage

English

Publisher

ieee

Conference_Titel

Electron Devices and Materials, 2008. EDM 2008. 9th International Workshop and Tutorials on

Conference_Location

Novosibirsk

ISSN

1815-3712

Print_ISBN

978-5-7782-0893-3

Type

conf

DOI

10.1109/SIBEDM.2008.4585865

Filename

4585865