• DocumentCode
    2373772
  • Title

    Microfluidic package design for magnetoresistive biosensors

  • Author

    Tondra, Mark C. ; Bardell, Ron L. ; Datta, Proyag

  • Author_Institution
    Diagnostic Biosensors, LLC, Minneapolis, MN, USA
  • fYear
    2009
  • fDate
    3-6 Sept. 2009
  • Firstpage
    5428
  • Lastpage
    5431
  • Abstract
    In order for magnetoresistive biosensor technology to become a mainstream product for clinical and consumer use, several outstanding technical issues must be solved. This paper will focus on one of those issues, which is the need to adapt standard semiconductor packaging processes to fall within some biosensor fabrication process constraints. A set of materials and interconnection methods that meet these biosensor requirements are presented. The resulting architecture is compatible with laboratory assembly, but can be scaled up to small and medium manufacturing quantities by using larger 2-dimensional areas per production batch.
  • Keywords
    bioMEMS; biosensors; interconnections; magnetoresistive devices; microfabrication; microfluidics; microsensors; semiconductor device packaging; biosensor fabrication process; interconnection method; magnetoresistive biosensor technology; medium manufacturing quantities; microfluidic package design; production batch; semiconductor packaging processes; small manufacturing quantities; Biosensing Techniques; Computer-Aided Design; Electric Impedance; Equipment Design; Magnetics; Microfluidics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2009. EMBC 2009. Annual International Conference of the IEEE
  • Conference_Location
    Minneapolis, MN
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-3296-7
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/IEMBS.2009.5332478
  • Filename
    5332478