• DocumentCode
    2373859
  • Title

    Tuning hydrogel properties for applications in tissue engineering

  • Author

    Khetan, Sudhir ; Chung, Cindy ; Burdick, Jason A.

  • Author_Institution
    Dept. of Bioeng., Univ. of Pennsylvania, Philadelphia, PA, USA
  • fYear
    2009
  • fDate
    3-6 Sept. 2009
  • Firstpage
    2094
  • Lastpage
    2096
  • Abstract
    Biomaterial design is an important component towards tissue engineering applications. There are many parameters that may be adjusted including physical properties (i.e., degradation and mechanics) and chemical properties (e.g., adhesion and cellular interactions). These design components may dictate the success or failure of a tissue engineering approach. Our group is particularly interested in the use of swollen hydrogels as cell carriers. One material that is used to fabricate hydrogels is hyaluronic acid (HA), which is found in many tissues in the body. Here, we show the control over hydrogel degradation, both in the bulk and locally to cells to control both the distribution of extracellular matrix by cells and whether or not a cell spreads in the hydrogels. These signals are important in the final structure and mechanical properties of engineered tissues, and potentially the differentiation of encapsulated stem cells.
  • Keywords
    adhesion; biomedical materials; cellular biophysics; polymer gels; tissue engineering; adhesion; cell carriers; cellular interactions; encapsulated stem cells; extracellular matrix; hyaluronic acid; hydrogel degradation; tissue engineering; tuning hydrogel property; Adult; Cell Differentiation; Humans; Hyaluronic Acid; Hydrogel; Musculoskeletal Abnormalities; Stem Cells; Tissue Engineering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2009. EMBC 2009. Annual International Conference of the IEEE
  • Conference_Location
    Minneapolis, MN
  • ISSN
    1557-170X
  • Print_ISBN
    978-1-4244-3296-7
  • Electronic_ISBN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/IEMBS.2009.5332484
  • Filename
    5332484