DocumentCode
2374234
Title
Modelling Smart Card Security Protocols in SystemC TLM
Author
Bushager, Aisha ; Zwolinski, Mark
Author_Institution
Sch. of Electron. & Comput. Sci., Univ. of Southampton, Southampton, UK
fYear
2010
fDate
11-13 Dec. 2010
Firstpage
637
Lastpage
643
Abstract
Smart cards are an example of advanced chip technology. They allow information transfer between the card holder and the system over secure networks, but they contain sensitive data related to both the card holder and the system, that has to be kept private and confidential. The objective of this work is to create an executable model of a smart card system, including the security protocols and transactions, and to examine the strengths and determine the weaknesses by running tests on the model. The security objectives have to be considered during the early stages of systems development and design, an executable model will give the designer the advantage of exploring the vulnerabilities early, and therefore enhancing the system security. The Unified Modeling Language (UML) 2.0 is used to model the smart card security protocol. The executable model is programmed in SystemC with the Transaction Level Modeling (TLM) extensions. The final model was used to examine the effectiveness of a number of authentication mechanisms with different probabilities of failure. In addition, a number of probable attacks on the current security protocol were modeled to examine the vulnerabilities. The executable model shows that the smart card system security protocols and transactions need further improvement to withstand different types of security attacks.
Keywords
C language; Unified Modeling Language; protocols; security of data; smart cards; SystemC; Unified Modeling Language 2.0; security protocols; smart card system; transaction level modeling; Modelling Languages; Smart Cards; SystemC; Transaction Level Modelling;
fLanguage
English
Publisher
ieee
Conference_Titel
Embedded and Ubiquitous Computing (EUC), 2010 IEEE/IFIP 8th International Conference on
Conference_Location
Hong Kong
Print_ISBN
978-1-4244-9719-5
Electronic_ISBN
978-0-7695-4322-2
Type
conf
DOI
10.1109/EUC.2010.102
Filename
5703589
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