DocumentCode
2375206
Title
High-overtone, bulk acoustic resonator frequency stability improvements
Author
Caldwell, S.P. ; Driscoll, M.M. ; Stansberry, S.D. ; Bailey, D.S. ; Salvo, H.L.
Author_Institution
Westinghouse Electronic Syst. Group, Baltimore, MD, USA
fYear
1993
fDate
2-4 Jun 1993
Firstpage
744
Lastpage
748
Abstract
In an effort to counter the effects of both moderate-term and long-term frequency instability associated with the (-30 PPM/°C) frequency-temperature coefficient in high overtone, bulk acoustic resonators (HBAR), AFC loop stabilization of low-noise, 640 MHz HBAR oscillators has been demonstrated. A thermoelectric (TE) cooler is used as the resonator frequency tuning element. The TE cooler approach provides a means of obtaining near-equal device heating and cooling time-response characteristics, allowing stable loop operation. Using this technique, long-term, fractional frequency stability improvement to five parts in 107 has been demonstrated. Prototype resonators have been fabricated on thicker (700 ns delay) YAG crystals and evaluated in oscillators operating at both 320 MHz and 640 MHz that exhibit flicker-of-frequency noise comparable, on a Sy(f) basis, to that reported for ultra-low noise, multiple crystal oscillators operating in the 80-100 MHz range
Keywords
UHF oscillators; acoustic resonators; bulk acoustic wave devices; crystal oscillators; flicker noise; frequency stability; 320 MHz; 640 MHz; AFC loop stabilization; HBAR oscillators; YAG crystals; YAl5O12; flicker-of-frequency noise; frequency stability; frequency-temperature coefficient; high overtone bulk acoustic resonators; multiple crystal oscillators; resonator frequency tuning element; stable loop operation; thermoelectric cooler; time-response characteristics; 1f noise; Acoustic devices; Automatic frequency control; Counting circuits; Oscillators; Resonant frequency; Stability; Tellurium; Thermoelectricity; Tuning;
fLanguage
English
Publisher
ieee
Conference_Titel
Frequency Control Symposium, 1993. 47th., Proceedings of the 1993 IEEE International
Conference_Location
Salt Lake City, UT
Print_ISBN
0-7803-0905-7
Type
conf
DOI
10.1109/FREQ.1993.367472
Filename
367472
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