Al/TiN/W/Si contact metallization using multi-chamber deposition system

Thermally Stable Al/TiN/W/Si contact metallization was fabricated using a multi-chamber deposition system that included a selective CVD module, a sputter etching module, and sputter deposition modules. The thermal stability of the contact resistance was affected by the exposure of W plugs to air. Sequentially deposited samples showed low and stable contact resistance up to 550°C. In contrast, for samples exposed to air after W plug formation, contact resistance was unstable. Air-exposure of the W plug degraded the contact system´s thermal stability